Difference between revisions of "N82AP (Internals)"

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Following is a tear down graphic by Semiconductor Insights reported about [http://www.techonline.com/product/underthehood/209000013;jsessionid=OE0PYVMJ22XYIQSNDLPCKH0CJUNN2JVN here].
 
Following is a tear down graphic by Semiconductor Insights reported about [http://www.techonline.com/product/underthehood/209000013;jsessionid=OE0PYVMJ22XYIQSNDLPCKH0CJUNN2JVN here].
   
'''Top side'''
+
== Top side ==
   
 
[[Image:Hardware3g.JPG]]
 
[[Image:Hardware3g.JPG]]
   
'''Bottom side'''
+
== Bottom side ==
   
 
[[Image:Hardware3G_bottom.jpg]]
 
[[Image:Hardware3G_bottom.jpg]]
   
Important differences from the internals of original iPhone:
+
== Important differences from the internals of original iPhone ==
 
* Battery is no longer soldered.
 
* Battery is no longer soldered.
 
* CSR Bluetooth chip updated to [http://www.csr.com/bc6/index.php BlueCore6-ROM]. If you know what BT profiles this chip supports, please add.
 
* CSR Bluetooth chip updated to [http://www.csr.com/bc6/index.php BlueCore6-ROM]. If you know what BT profiles this chip supports, please add.

Revision as of 20:14, 29 July 2008

iFixit has a run down of all iPhone components here which includes some datasheets.

Following is a tear down graphic by Semiconductor Insights reported about here.

Top side

Hardware3g.JPG

Bottom side

Hardware3G bottom.jpg

Important differences from the internals of original iPhone

  • Battery is no longer soldered.
  • CSR Bluetooth chip updated to BlueCore6-ROM. If you know what BT profiles this chip supports, please add.
  • (Anyone have more? please add)