Difference between revisions of "N82AP"

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Following is a tear down graphic by Semiconductor Insights reported about [http://www.techonline.com/product/underthehood/209000013;jsessionid=OE0PYVMJ22XYIQSNDLPCKH0CJUNN2JVN here].
 
Following is a tear down graphic by Semiconductor Insights reported about [http://www.techonline.com/product/underthehood/209000013;jsessionid=OE0PYVMJ22XYIQSNDLPCKH0CJUNN2JVN here].
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'''Top side'''
 
'''Top side'''
   
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Note the updated CSR Bluetooth chip. Anyone has more info on the available profiles on this chip?
 
Note the updated CSR Bluetooth chip. Anyone has more info on the available profiles on this chip?
 
[[Image:Hardware3G_bottom.jpg]]
 
[[Image:Hardware3G_bottom.jpg]]
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  +
Important differences from the internals of original iPhone:
  +
-Battery is no longer soldered

Revision as of 22:06, 28 July 2008

This is the iPhone 3G. It was released on July 11, 2008 with a price tag of $199 for the 8GB model and $299 for the 16GB model, in the US market. Price varies depending on the operator selling it. Features the inclusion of 3G networking and GPS, along with a tapered plastic back in black and white colors.

Internals

iFixit has a run down of all iPhone components here which includes some datasheets.

Following is a tear down graphic by Semiconductor Insights reported about here.

Top side

Hardware3g.JPG

Bottom side

Note the updated CSR Bluetooth chip. Anyone has more info on the available profiles on this chip? Hardware3G bottom.jpg

Important differences from the internals of original iPhone: -Battery is no longer soldered